CVE-2019-19196
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key…
Does this matter?
Lower severity and a low EPSS score (1.36%). Track it; it rarely justifies an emergency change on its own.
Description
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.
- CVSS 3.1
- 6.5 MEDIUMCVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
- EPSS
- 1.36% probability · 70th percentile
- CISA KEV
- Not listed
- Weakness
- CWE-120
- Affected
- telink-semi/tlsr8258 ble sdk · telink-semi/tlsr8269 ble sdk · telink-semi/tlsr8253 ble sdk · telink-semi/tlsr8251 ble sdk · telink-semi/tlsr8232 ble sdk
- Source
- cve@mitre.org
References
- http://www.telink-semi.com/bleVendor Advisory
- https://asset-group.github.io/disclosures/sweyntooth/Exploit, Third Party Advisory
- http://www.telink-semi.com/bleVendor Advisory
- https://asset-group.github.io/disclosures/sweyntooth/Exploit, Third Party Advisory
Source: NVD record, EPSS from FIRST.org, KEV from CISA. Refreshed daily.