VulnerabilityModified
CVE-2017-18297
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
HIGH 7.8EPSS 0.26%
Does this matter?
High impact if exploited, but EPSS currently rates exploitation as unlikely (0.26%). Schedule it in the normal patch cycle and watch for a rise in EPSS or a public exploit.
Description
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
- CVSS 3.0
- 7.8 HIGHCVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
- EPSS
- 0.26% probability · 18th percentile
- CISA KEV
- Not listed
- Weakness
- CWE-415
- Affected
- qualcomm/sd 425 firmware · qualcomm/sd 430 firmware · qualcomm/sd 450 firmware · qualcomm/sd 625 firmware · qualcomm/sd 650 firmware · qualcomm/sd 652 firmware · qualcomm/sd 820 firmware
- Source
- product-security@qualcomm.com
References
- http://www.securitytracker.com/id/1041432Third Party Advisory, VDB Entry
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-componentsThird Party Advisory
- https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
- http://www.securitytracker.com/id/1041432Third Party Advisory, VDB Entry
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-componentsThird Party Advisory
- https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
Source: NVD record, EPSS from FIRST.org, KEV from CISA. Refreshed daily.