CVE-2017-18157
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD…
Does this matter?
High impact if exploited, but EPSS currently rates exploitation as unlikely (0.24%). Schedule it in the normal patch cycle and watch for a rise in EPSS or a public exploit.
Description
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
- CVSS 3.0
- 7.8 HIGHCVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
- EPSS
- 0.24% probability · 16th percentile
- CISA KEV
- Not listed
- Weakness
- CWE-416
- Affected
- qualcomm/mdm9206 firmware · qualcomm/mdm9607 firmware · qualcomm/mdm9650 firmware · qualcomm/msm8909w firmware · qualcomm/msm8996au firmware · qualcomm/sd 210 firmware · qualcomm/sd 212 firmware · qualcomm/sd 205 firmware · qualcomm/sd 425 firmware · qualcomm/sd 450 firmware · qualcomm/sd 615 firmware · qualcomm/sd 616 firmware · qualcomm/sd 415 firmware · qualcomm/sd 625 firmware · qualcomm/sd 650 firmware · qualcomm/sd 652 firmware · qualcomm/sd 820 firmware · qualcomm/sd 820a firmware · qualcomm/sd 835 firmware · qualcomm/sd 845 firmware · +1 more
- Source
- product-security@qualcomm.com
References
- https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
- https://www.qualcomm.com/company/product-security/bulletinsVendor Advisory
Source: NVD record, EPSS from FIRST.org, KEV from CISA. Refreshed daily.